AI Infrastructure
AI data centers
Pulls heat away from 1,000 W+ GPUs and servers.
01 Thermal Materials
Heat flows,electricity stops
A Cu-C hybrid TIM filler that fills the gap between hot components and heat sinks. Spherical Cu-C particles carry a SiO₂ insulating coat.
01Key Performance
Four conditionsin one filler
Conducts well, dispenses easily, insulates and lasts.
-
12W/mK
Isotropic thermal conductivity
-
≤300Pa·s
Auto-dispensing viscosity
-
1012Ω·cm
Volume resistivity
-
1,000+
Thermal cycle durability
02Product Forms
Supplied as gap fillers and thermal sheets.
Thickness ranges from 0.1 to 0.5 mm. Viscosity at or below 300 Pa·s suits automated dispensing.
Gap fillers
Fill the gaps between battery cells and modules, or chips and heat sinks.
Thermal sheets
Light and thin, suited to drones and small mobility.
Isotropic conduction
A 3D copper network reaches 12 W/mK in every direction.
03How It Is Made
Four stepsat 700℃ or below
Ceramic fillers need processes above 2,000℃; ours runs at mid-to-low temperatures.
- STEP 01
Coffee grounds pre-treatment
Defatting and activation extract coffee oil and polyphenols and form a porous carbon precursor at near-zero raw cost.
- STEP 02
Spray pyrolysis
Ultrasonic droplets form 10 μm spherical CuO-C particles that roll like ball bearings, tackling viscosity at the source.
- STEP 03
Reduction heat treatment
Reduction at 700℃ or below builds a continuous 3D copper network for isotropic 12 W/mK.
- STEP 04
SiO₂ nano-coating
A sol-gel coating under 50 nm prevents copper oxidation and secures 10¹² Ω·cm volume resistivity.
04Versus Ceramic
Lower heat,more even
| Item | Ceramic filler | Thermophene Cu-C |
|---|---|---|
| Process temperature | 2,000℃ or higher | 700℃ or below |
| Heat direction | Depends on particle shape | Isotropic via Cu 3D network |
| Carbon | High emissions from high-heat processes | 100% biogenic carbon |
| Supply | Japan, US and Germany | Domestic core technology |
05Applications
From small dronesto AI infrastructure
Electric Vehicle
EV batteries
Gap fillers between cells spread heat evenly.
Energy Storage
Energy storage
Improves long-term reliability of always-on storage.
Small Mobility
Drones and small mobility
Light, thin fillers and sheets cool ESCs and batteries.
Electronics
Chip packages
Fills chip-to-heatsink gaps to cut contact resistance.
Beyond Cooling, Towards Green
From samples to joint research,let's start together
Sample requests, partnerships or investment. Leave a note and we will reply personally.
